Copper Nitride: A Versatile Semiconductor with Great Potential for Next-Generation Photovoltaics

نویسندگان

چکیده

Copper nitride (Cu3N) has gained significant attention recently due to its potential in several scientific and technological applications. This study focuses on using Cu3N as a solar absorber photovoltaic technology. thin films were deposited glass substrates silicon wafers via radio-frequency magnetron sputtering at different nitrogen flow ratios with total pressures ranging from 1.0 5.0 Pa. The films’ structural, morphology, chemical properties determined XRD, Raman, AFM, SEM/EDS techniques. results revealed that the exhibited polycrystalline structure, preferred orientation varying 100 111 depending working pressure employed. Raman spectroscopy confirmed presence of Cu-N bonds characteristic peaks observed 618–627 cm−1 range, while SEM AFM images uniform smooth surface morphologies. optical investigated UV-VIS-NIR photothermal deflection (PDS). obtained band gap, refractive index, Urbach energy values demonstrated promising for films, indicating their absorbers highlights favourable RF method, paving way implementation thin-film technologies. These findings contribute progress optimisation Cu3N-based materials efficient conversion.

برای دانلود رایگان متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Nonpolar Nitride Semiconductor Optoelectronic Devices: a Disruptive Technology for next Generation Army Applications

Nonpolar nitride semiconductor materials containing a wide range of structural defects are studied. High quality InGaN quantum wells grown on bulk stacking fault (SF) -free GaN substrates show larger PL intensity and shorter PL lifetime with decreasing well width, indicating that the radiative lifetime is becoming smaller as the well narrows, consistent with the theoretically predicted increase...

متن کامل

Semiconductor nanowire array: potential substrates for photocatalysis and photovoltaics

A novel vapor–liquid–solid epitaxy (VLSE) process has been developed to synthesize high-density semiconductor nanowire arrays. The nanowires generally are single crystalline and have diameters of 10–200nm and aspect ratios of 10–100. The areal density of the array can readily approach 10 cm . Results based on Si and ZnO nanowire systems are reported here. Because of their single crystallinity a...

متن کامل

A Method for Generation Phage Cocktail with Great Therapeutic Potential

BACKGROUND Bacteriophage could be an alternative to conventional antibiotic therapy against multidrug-resistant bacteria. However, the emergence of resistant variants after phage treatment limited its therapeutic application. METHODOLOGY/PRINCIPAL FINDINGS In this study, an approach, named "Step-by-Step" (SBS), has been established. This method takes advantage of the occurrence of phage-resis...

متن کامل

Next Generation High-Efficiency Low-cost Thin Film Photovoltaics

Our goal is to develop novel growth approaches for producing low cost solar cells that have efficiency comparable to those made from high-cost, single-crystalline materials. Our efforts to date focus on using ion beam assisted deposition (IBAD) to control the grain boundary alignment in polycrystalline silicon thin films. The boundaries between highly aligned grains have smaller defect densitie...

متن کامل

Invited paper Semiconductor cleaning technology for next generation material systems

This paper gives a brief overview of the challenges wafer cleaning technology is facing in the light of advanced silicon technology moving in the direction of non-planar device structures and the need for modified cleans for semiconductors other than silicon. In the former case, the key issue is related to cleaning and conditioning of vertical surfaces in next generation CMOS gate structure as ...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

ژورنال

عنوان ژورنال: Coatings

سال: 2023

ISSN: ['2079-6412']

DOI: https://doi.org/10.3390/coatings13061094